Packaging

WBBGA
Wire Bond is a type of connection betwee...
fcBGA
FC technology is to flip bonding the chi...
SiP
SiP stands for system-in-package, which refers to ...
fcCSP
FcCSP package adopts core or non-core substra...
QFN
QFN is a leadless package , which is square or rec...
CPGA
Ceramic materials are heterogeneous inorganic non-...
SOP
SOP, also known as SOIC (SmallOutline Integrated C...
QFP
QFP is a four-side pin flat package, it is a surfa...